WOTAN (Excursion Control)
Excursion control and Fab monitoring macro inspection system (AOI)
Recipe-free option and very easy to use User-interface.
10 µm sensitivity configurations at over 150 wph (SECS/GEM/E84).
Real all side wafer inspection: Parallel front and back side and wafer edge inspection without throughput impact
Industry best cost of ownership AOI.
Backside signature recognition with ABSENT (defect data filtering and mass data processing technologies).
Bridge tools, sorter function and special handling systems for thin/double wafers available.
Advanced Defect Binning (ADB).
100% defect images on the fly
Fully automated high-speed AOI tool for front and back side macro defect inspection.

Key Features