Fully automated, high-speed, high sensitivity AOI tool for edge inspection in all five zones and metrology.

Key Features
Highest throughput wafer edge inspection and metrology system.
Industry leading cost of ownership.
5 µm sensitivity at 150 wafers per hour.
Edge zones defect inspection.
Parallel multi-line EBR/WEE metrology for all zones.
HSEB IP defect imaging technologies to enable easy yield engineering.
Special handling systems for thin/double wafers available.
Also available as 3rd party OEM integrated module.
Advanced Defect Binning (ADB).