High troughput, high resolution
Film thickness metrology platform.
Differential reflectometric metrology:
o Resolution, accuracy and reporducibility at
Sub-Å thickness accuracy
o Thickness measurements with accuracy and
o Spatial optical resolution better 0.5 µm (upto 5
o Full wafer map at high speed (50 wph)
o Thickness defect review
o Automated tool calibration
Lowest particle contamination (max added particle and metallic contamination above/below wafer vendor demands)
Full-automated material tracking.
Can be combined with THOR edge inspection modules