BALDUR (FDSOI METROLOGY)
Fully automated, high-speed metrology platform for FD-SOI applications.

Key Features
High troughput, high resolution
Film thickness metrology platform.
Differential reflectometric metrology:
   o  Resolution, accuracy and reporducibility at
       Sub-Å thickness accuracy
   o  Thickness measurements with accuracy and
       reproducibility ≥99.8%
   o  Spatial optical resolution better 0.5 µm (upto 5
       magnifications)
   o  Full wafer map at high speed (50 wph)
   o  Thickness defect review
   o  Automated tool calibration

FD-SOI
Thin layer
Lowest particle contamination (max added particle and metallic contamination above/below wafer vendor demands)
Full-automated material tracking.
Can be combined with THOR edge inspection modules
Applications