- scratches, particles
- focussing problems
- ADI defects
- bare wafer incoming inspection (IQC)
- MEMS quality control
- 100 % archiving and documentation
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- Manual defect classification, such as of inspection data
- Judgement of scratches, particles, voids, vias, pads or pattern defects
- Detection of defocussing, inhomogeneity
- Determination of topographic information
- Automatic optical review with defect recognition
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- Thickness measurement of multiple (also of buried) films
- Silicon membrane and air cavern thickness measurements
- Determination of optical properties of films, such as R.I.
- Critical dimension, overlay and diameter measurement
- Complex CD measurement at different focus levels
- Alignment mark check
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- Infrared microscopy for inspection and measurement of buried structures
- Inspection of bonded wafers
- Overlay measurement of buried structures against references on wafer surface
- Silicon membrane and air cavern measurements, including topography and roughness
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- Detection of delamination, cracks and chipouts
- EBR/WEE width and eccentricity measurement, exposure tool supervision
- Edge imaging with automatic defect detection and pre-classification
- Archiving and documentation of wafer edge defects
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- Versatile stand-alone microscopes for all common contrast techniques
- High-end optics by Carl Zeiss, objective range from 1.25x ... 100x
- Incident and reflected light illumination, from deep UV to NIR
- Brightfield, darkfield, DIC, while-light confocal, fluorescence and polarization microscopy
- Laser and image-based autofocus units for fatigue-free operation
HSEB Dresden is a leading supplier in optical inspection, review and metrology. We design and manufacture tools, modules and OEM components for wafer sizes up to 450 mm and for any kind of large and flat substrates. Based on a range of well-established inspection systems, we take pride in customizing our tools, until they perfectly fit your needs.
Decades of experience in optics, engineering and software allow us to tailor manual and automated systems which meet all your demands for the manufacture of semiconductor devices and micro-electromechanical systems (MEMS).
Since 1991 and from the background of the founder with the Dresden-based R&D centre of Carl Zeiss Jena, HSEB has evolved from a pure development office into a comprehensive medium-sized production company with a emphasis on development and customization.
HSEB is member in the following organizations:
Decades of experience in optics, engineering and software allow us to tailor manual and automated systems which meet all your demands for the manufacture of semiconductor devices and micro-electromechanical systems (MEMS).
Since 1991 and from the background of the founder with the Dresden-based R&D centre of Carl Zeiss Jena, HSEB has evolved from a pure development office into a comprehensive medium-sized production company with a emphasis on development and customization.
HSEB is member in the following organizations:
CONTACT
HSEB Dresden GmbH
Manfred-von-Ardenne-Ring 4
01099 Dresden
Germany
phone: +49-351-20758-0
fax: +49-351-20758-890
Manfred-von-Ardenne-Ring 4
01099 Dresden
Germany
phone: +49-351-20758-0
fax: +49-351-20758-890
Trade Fairs
Semicon West
San Francisco
July 09-11, 2013
San Francisco
July 09-11, 2013